The main function is for cell production,cell cutting,mental material and Silicon, germanium, gallium arsenide and other semiconductor substrate scribing and cutting.
1.The laser power is continuously adjustable, good beam quality, narrow kerf, less cell loss after processing.
2.Acousto-optic modulation system.X-Y motion working platform.
3.CNC program with friendly operation interface to speed up efficiency.
4.Total machine power is low,no consumable parts.
5.Environmental,energy saving.
Products
